CSCMP 2013 Preview
October 18, 2013 Transplace

CSCMP 2013 Preview

Come connect with us at CSCMP next week (October 20-23) at the Colorado Convention Center in Denver!  Whether it’s stopping by our booth (#212), checking out one of our 4 speaker sessions or following us on Twitter (@Transplace – be sure to follow/use the #CSCMP2013 hashtag!) and/or Facebook, we are very excited to be participating in this great event and are looking forward to connecting with you!

Additionally, we have a great lineup of speakers this year, including several company leaders speaking on a variety of transportation topics:

  • Transplace CEO Tom Sanderson will be participating on a panel on “ROI of Operational Excellence in the Supply Chain – HowHow Do You Know It’s Worth It?”, taking place on Monday, October 21 from 3:30 p.m. to 5:00 p.m. in Room 603. Later in the week he joins another panel to discuss the latest thinking and innovations in the areas of leadership and career development. This panel is on Wednesday, October 23 from 8:00 a.m. to 9:30 a.m. in the Four Seasons Ballroom.
  • Jose Minarro, Transplace Mexico’s managing director, will speak on “Right Sourcing—The Benefits of Locating Production Closer to Home” on Tuesday, October 22 from 9:45 a.m. to 11:15 a.m. in room #207.
  • Transplace Senior Vice President of Engineering and Consulting Ben Cubitt will discuss “SmartWay Transport Partnership: Driving Data Integrity in Transportation Supply Chains.” The session takes place on Tuesday, October 22 from 3:00 p.m. to 4:30 p.m. in the Four Seasons Ballroom 2-3.

We will also be showcasing our co-loading expertise through our TransMATCH solution during the CSCMP Supply Chain Exchange Exhibition.  For shippers facing underutilized capacity, TransMATCH is the 3PL co-load solution that creates cost savings and a competitive advantage.  Find out more at (link: http://www.transmatchcoload.com/)

Can it be Sunday already?! We hope you stop by and say hello! We look forward to connecting with you!

0 Comments

Leave a reply

Your email address will not be published. Required fields are marked *

*